JPH08759Y2 - 半導体素子収納用パッケージ - Google Patents
半導体素子収納用パッケージInfo
- Publication number
- JPH08759Y2 JPH08759Y2 JP1989074672U JP7467289U JPH08759Y2 JP H08759 Y2 JPH08759 Y2 JP H08759Y2 JP 1989074672 U JP1989074672 U JP 1989074672U JP 7467289 U JP7467289 U JP 7467289U JP H08759 Y2 JPH08759 Y2 JP H08759Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- package
- package body
- semiconductor element
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 23
- 239000010410 layer Substances 0.000 claims description 60
- 238000001465 metallisation Methods 0.000 claims description 18
- 239000011247 coating layer Substances 0.000 claims description 17
- 238000007747 plating Methods 0.000 claims description 12
- 239000003550 marker Substances 0.000 claims description 9
- 239000012777 electrically insulating material Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000010304 firing Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989074672U JPH08759Y2 (ja) | 1989-06-26 | 1989-06-26 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989074672U JPH08759Y2 (ja) | 1989-06-26 | 1989-06-26 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0313742U JPH0313742U (en]) | 1991-02-12 |
| JPH08759Y2 true JPH08759Y2 (ja) | 1996-01-10 |
Family
ID=31614568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989074672U Expired - Lifetime JPH08759Y2 (ja) | 1989-06-26 | 1989-06-26 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08759Y2 (en]) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5748869B2 (en]) * | 1972-02-23 | 1982-10-19 | ||
| JPS5935498A (ja) * | 1982-08-23 | 1984-02-27 | 日本電気ホームエレクトロニクス株式会社 | プリント配線体 |
| JPS6146739U (ja) * | 1984-08-31 | 1986-03-28 | 富士通株式会社 | 半導体容器 |
-
1989
- 1989-06-26 JP JP1989074672U patent/JPH08759Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0313742U (en]) | 1991-02-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |